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Electronics Manufacturing Processes - Micro Circuit Encapsulation
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Encapsulation is a process of accurately applying an epoxy of encapsulation compound to a circuit to protect delicate wirebonds or electrical connections and to insulate electronic circuitry. Wirebonded micro-electronic circuits often use this process after surface mounting and wirebonding of silicon chips. Encapsulation is also commonly used to protect and insulate the connections on small electrical plugs, PCB connections or anywhere additional connection strength is desired.
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