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Electronics Manufacturing - Hybrid Electronic Circuit Manufacturing, Hybrid PCB Manufacturing
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What is a hybrid PCB?
A thick film hybrid is an alternative to a printed circuit board (PCB), it is generally smaller, more secure and more robust than a PCB. A hybrid can work under water, buried in sand and in extreme heat - in most cases a PCB can't. Thick film hybrid microcircuit technology involves the precision screen printing and firing of conductors, resistors and dielectrics onto a ceramic, titanium or stainless steel substrate for multilayer circuitry.
Resistors are laser trimmed to achieve precise values and this can be done after surface mount assembly to achieve functional circuit adjustment. A wide range of resistor values from milli-ohms to giga-ohms along with ratings of up to tens of thousands of volts and fractional ratio tolerances can be achieved.
Assembly is normally performed using surface mount components and pick and place technology or, alternatively, silicon chips and wire bonding can be used. Thick film hybrids are used as an alternative to printed circuit boards (PCB's) as well as in conjunction with PCB's.
Hybrid Electronics Technology Research and MEMS Devices
Hybrid electronics is an interdisciplinary research area that stems from the necessities of an ever-evolving electronics industry. Problems concerning high-performance, power-consumption and cost of materials are addressed using MEMS developments and device physics knowledge. Hybrid electronics aims to create a field of mechanically-conscious device physics in which the best characteristics of solid state devices can be enhanced using mechanical means. Challenges are faced in nanoscale processing, solid-state simulation, and mechanical design beyond the microscale regime.
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