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Welding and Joining Processes - Anodic Bonding
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Anodic bonding is a method of hermetically and permanently joining glass to silicon without the use of adhesives. The silicon and glass wafers are heated to a temperature (typically in the range 300-500oC depending on the glass type) at which the alkali-metal ions in the glass become mobile. The components are brought into contact and a high voltage applied across them. This causes the alkali cations to migrate from the interface resulting in a depletion layer with high electric field strength. The resulting electrostatic attraction brings the silicon and glass into intimate contact. Further current flow of the oxygen anions from the glass to the silicon results in an anodic reaction at the interface and the result is that the glass becomes bonded to the silicon with a permanent chemical bond.
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