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Electronic Manufacturing Processes - Wire Bonding
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In the field of microelectronics, one of the most important manufacturing techniques is wire bonding. Wirebonding is a technique used to install wire connections between a surface mounted component and the PCB circuit on a micro scale.
The bonds are created automatically by a wirebonding machine. Each wire is bonded by applying heat and pressure to the connection resulting in a fusion bond between the wire and the bond pad. The wire bonding machine tightly controls the bond location and wire loop shape and height, and trims the wire after the connection is made. Bond pads must be kept perfectly clean and free from particles to ensure a good bond. Bond pads are often plasma cleaned prior to wire bonding to ensure surfaces are free from organic contamination. Wire bonding is typically carried out in a clean room having a very high cleanliness rating. There are 2 variations on the wire bond type - wedge wire bonding and ball bonding.
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